Diamond cut-off wheels Type LR ⌀ 100 x 0,5 x 12,7 mm
Delivered with a dressing stick. Resin bond. High concentration disc, advised when you want the best cutting quality. To cut hard and fragile materials, composites, plasma deposit, ceramics, electronic components.
Diamond cut-off wheels Type LR ⌀ 125 x 0,5 x 12,7 mm
Delivered with a dressing stick. Resin bond. High concentration disc, advised when you want the best cutting quality. To cut hard and fragile materials, composites, plasma deposit, ceramics, electronic components.
Diamond cut-off wheels Type LR ⌀ 150 x 0,6 x 12,7 mm
Delivered with a dressing stick. Resin bond. High concentration disc, advised when you want the best cutting quality. To cut hard and fragile materials, composites, plasma deposit, ceramics, electronic components.
Diamond cut-off wheels Type LR ⌀ 175 x 0,7 x 12,7 mm
Delivered with a dressing stick. Resin bond. High concentration disc, advised when you want the best cutting quality. To cut hard and fragile materials, composites, plasma deposit, ceramics, electronic components.
Diamond cut-off wheels Type LR ⌀ 200 x 0,9 x 32 mm
Delivered with a dressing stick. Resin bond. High concentration disc, advised when you want the best cutting quality. To cut hard and fragile materials, composites, plasma deposit, ceramics, electronic components.
Diamond cut-off wheels Type LR ⌀ 250 x 1,2 x 32 mm
Delivered with a dressing stick. Resin bond. High concentration disc, advised when you want the best cutting quality. To cut hard and fragile materials, composites, plasma deposit, ceramics, electronic components.
Diamond cut-off wheels Type LR ⌀ 300 x 1,2 x 32 mm
Delivered with a dressing stick. Resin bond. High concentration disc, advised when you want the best cutting quality. To cut hard and fragile materials, composites, plasma deposit, ceramics, electronic components.
Diamond cut-off wheels Type LR ⌀ 75 x 0,5 x 12,7 mm
Delivered with a dressing stick. Resin bond. High concentration disc, advised when you want the best cutting quality. To cut hard and fragile materials, composites, plasma deposit, ceramics, electronic components.