Diamond wire saw 3400
Fine cutting and absolute precision. With their stainless steel wire set with diamonds, the diamond wire saws cuts most materials. It is particularly recommended for cutting delicate samples such as silicon, glass or electronic components. Low speeds allow samples to be cut whilst protecting materials and preventing overheating. They ensure flat cut surfaces with clear edges, avoiding modifications to the structure on each side of the cut.
Diamond wire saw 3500 BASE
Fine cutting and absolute precision. With their stainless steel wire set with diamonds, the diamond wire saws cuts most materials. It is particularly recommended for cutting delicate samples such as silicon, glass or electronic components. Low speeds allow samples to be cut whilst protecting materials and preventing overheating. They ensure flat cut surfaces with clear edges, avoiding modifications to the structure on each side of the cut.
Diamond wire saw 3500 PREMIUM
Fine cutting and absolute precision. With their stainless steel wire set with diamonds, the diamond wire saws cuts most materials. It is particularly recommended for cutting delicate samples such as silicon, glass or electronic components. Low speeds allow samples to be cut whilst protecting materials and preventing overheating. They ensure flat cut surfaces with clear edges, avoiding modifications to the structure on each side of the cut.
Diamond wire saw 4500
Fine cutting and absolute precision. With their stainless steel wire set with diamonds, the diamond wire saws cuts most materials. It is particularly recommended for cutting delicate samples such as silicon, glass or electronic components. Low speeds allow samples to be cut whilst protecting materials and preventing overheating. They ensure flat cut surfaces with clear edges, avoiding modifications to the structure on each side of the cut.
Diamond wire saw 6500
Fine cutting and absolute precision. With their stainless steel wire set with diamonds, the diamond wire saws cuts most materials. It is particularly recommended for cutting delicate samples such as silicon, glass or electronic components. Low speeds allow samples to be cut whilst protecting materials and preventing overheating. They ensure flat cut surfaces with clear edges, avoiding modifications to the structure on each side of the cut.